| Type: | Metal Target |
|---|---|
| Shape: | Round |
| Certification: | ISO |
| Chemical Composition: | Aluminum Silicon |
| Transport Package: | Vacuum Packed or Per Customer′s Request. |
| Specification: | Customized according to customer requirements |
| Customization: |
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Aluminum is a silver-white light metal. There is malleability. Commodities are often made into rods, sheets, foils, powders, ribbons and filaments. It can form an oxide film to prevent metal corrosion in humid air. Aluminum powder can burn violently when heated in the air and emit a dazzling white flame. It is easily soluble in dilute sulfuric acid, nitric acid, hydrochloric acid, sodium hydroxide and potassium hydroxide solution, but hardly soluble in water. The relative density is 2.70. Melting point is 660°C. The boiling point is 2327°C. The content of aluminum in the crust is second only to oxygen and silicon, ranking third, and is the most abundant metal element in the crust. The development of the three important industries of aviation, construction, and automobile requires the characteristics of materials to have the unique properties of aluminum and its alloys, which greatly facilitates the production and application of this new metal aluminum.
3N8-4N8 aluminum is mostly used for rolling aluminum foil of electrolytic capacitors, lighting fixtures and data storage. 5N-6N ultra-pure aluminum is mostly used in manufacturing semiconductor devices, manufacturing optoelectronic storage media, superconducting cable stabilization materials, and playing an important role in space shuttle scientific research. The picture below is the microscopic metallographic inspection picture of aluminum sputtering target, the average particle size is <300μm. We produce high-purity aluminum sputtering targets. Its biggest advantage is that in the process of physical vapor deposition, a thin film with excellent conductivity and particle minimization can be obtained. The following table is a certificate of composition analysis of 5N high-purity aluminum sputtering target.
Analysis methods used:
1. Use GDMS or ICP-OES to analyze metal elements;
2. Use LECO for gas element analysis.
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