| Type: | Metal Target |
|---|---|
| Shape: | Round |
| Certification: | ISO |
| Purity: | 99.9% |
| Chemical Composition: | Cooper |
| Transport Package: | Vacuum Packed or Per Customer′s Request. |
| Customization: |
|---|
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We can produce copper targets of various purity and requirements with a purity of 99.9%~99.9999%. The oxygen content can be as low as <1ppm. It is mainly used for display screen and touch screen wiring and its protective film, solar light absorption layer, semiconductor wiring, etc. industry. In addition to meeting the needs of customers for flat targets (the largest G8.5 generation), we can also produce copper rotating targets, which are mainly used in the touch screen industry. The crystal grains of the high-purity copper target are difficult to break. We can only control the growth of the crystal by super large deformation processing to obtain a fine and uniform microstructure, so as to ensure that the sputtering coating can obtain a lower erosion rate and reduce Sensitivity to particle formation during sputtering. The following figure shows two typical microscopic metallographic inspection pictures of copper sputtering targets, with an average particle size <50um.
Application:
Impurities in the copper sputtering target will reduce the conductivity of the material, and impurity elements are the main factor affecting the yield in the production of semiconductor films. Impurities in the form of titanium, phosphorous, calcium, iron, chromium and selenium are particularly critical. These metals are very low in our copper targets, and their impurity content is far below the standard value required by customers. The following table is the composition analysis certificate of the 4N high-purity copper sputtering target.
The analysis methods used are:
1. Use GDMS or ICP-OES to analyze metal elements;
2. Use LECO for gas element analysis.
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